Setting new direct imaging benchmarks
Available on all X series models
2.5x
Higher throughput for resist patterning (down to 30µm L/S) and DI solder mask imaging (DI links)
PX 4K
2x
Higher throughput for conventional solder masks
PX LUVIR®
3x
Higher depth of focus — best line quality on challenging topographies
PX 4K
PX 4K
Unmatched imaging efficiency and speed
Highest exposure speed on market
Highest efficiency per exposure head → lowest TCO
Down to 30µm L/S on challenging topographies
2.5x higher throughput per head
80% larger exposure field
3x higher depth of focus (±500 µm)
365-425 nm UV spectrum — up to 4 channels
50% less scans, 100% better performance
80% larger exposure field with 8.9 megapixels across a 4096 × 2176 pixel array and down to 30 µ L/S.
Reduced scans over the imaging area.
Significantly reduce exposure time and deliver 2-3x higher throughput per head for all standard and advanced PCB dry-film and DI solder mask applications (MLB/HDI)
Superior imaging quality and yields
3x higher optical depth of focus (±500 µm) — maintain a sharp, in-focus image across the panel
- Larger process window — expose complex boards with uneven surfaces, warpage or thickness variations without costly readjustments
- Improved process stability — greater tolerance for substrate variations means fewer rejects and more consistent imaging results across production runs
- Superior line quality — consistent imaging across varying surface heights ensures precise line definition even on challenging topographies
- Higher yields — extended DoF reduces defocus errors, directly improving production yields and reducing scrap
Controlled wide-range UV-wavelength spectrum (365–425 nm) — deliver superior quality, broader material compatibility and enhanced process stability
- Superior image quality — broad spectral coverage delivers sharper line edges, better resolution and higher contrast in exposed features
- Material flexibility — compatible with wide range of resist and ink chemistries—from traditional to latest high-performance formulations
Applications and configurations
Resist patterning
Printed circuit boards (inner/outer layer)
Solder mask imaging
DI solder mask (50-250 mJ/cm²)
Printed circuit boards
PX LUVIR®
Fastest solder mask imaging for conventional inks
Patented, award-winning UV+IR technology
Accelerated polymerization at lower UV power
All solder mask brands, types and colors
2x higher throughput on conventional solder masks
All solder mask colors and materials
Down to 30 µm dam and 50 µm SRO
Alignment accuracy down to ±10 µm
PX LUVIR® deep dive
Our patented UV+IR technology accelerates polymerization at lower UV power — enabling most efficient solder mask imaging on all conventional inks
Higher imaging speed and throughput
Advanced multi-wave UV-LED Illumination with up to 20W UV-power per head and highly efficient light distribution over the image plane
With the addition of IR (40W), less UV-power is needed for the complete polymerization of the ink
PX LUVIR® significantly reduces exposure time and delivers up to 2x higher throughput per head for all conventional solder mask applications (MLB/HDI) and ink types
UV-DMD field overlayed by IR laser beam of homogeneous intensity
Superior imaging quality and yields
2-4 UV-wavelength spectrum (365–425 nm) for high-quality sidewalls, minimal undercuts and excellent surface quality
- Superior image quality — broad spectral coverage delivers sharper line edges, better resolution and higher contrast in exposed features
- Material flexibility — compatible with wide range of traditional solder mask chemistries
50 µm solder dam
50 μm SM wet coating thickness
Sidewall profile on small feature
Applications and configurations
Printed circuit boards
Solder mask imaging
Conventional solder mask (250 – 1,500 mJ/cm²)
High-power IR laser
2-3 UV-wavelenghts
365 / (385) / 405 nm — green and all other colors
4 UV-wavelenghts
365 / 385 / 405 / 425 nm — including 425 nm blue for white solder mask
Best-in-class MTBF and MTTR
Advanced predictive maintenance and control capabilities — maximize uptime and prevent costly failures
Software and sensor enabled automated alignment, calibration, and real-time remote control of exposure heads minimize unplanned downtime and the need for on-site service
>90% of reported or diagnosed issues are being solved remotely without the need for on-site support
Virtually no downtime — seamless UV-LED “drop-in” replacements that can be applied in under 60 min. No recalibration needed
Reduced spare-parts costs — with fewer exposure heads needed per system and long-life UV-LEDs with smart “anti-aging” compensation
Lowest total cost of ownership
Highest imaging efficiency and speed reducing the number of exposure heads needed per system
- Significantly lower upfront investment
- Lowest maintenance and service costs for X series models with PX technology over the entire equipment lifecycle.
Compare
PX configurations
PX 4K
PX UV
PX LUVIR®
4K DLP-chip-powered DMD system
4096 × 2176 px
WQXGA DLP-chip-powered DMD system
2560 × 1600 px
High-performance lens system
PX 4K — 5/10/30µm L/S ∙ PX UV — 15µm L/S
Advanced multi-wave UV-LED system
365-425 nm ∙ 15,000+ h lifetime
IR laser add-on
High-power IR laser
Applications
One platform for
all applications
Resist patterning — finest lines on a wide range of materials
Solder mask imaging — all types, colors and brands
Oversized/XXL — 24” × endless and up to 48 × 110”
Applications
TCO* and OEE**
Industry-leading direct imaging efficiency. Reduced complexity. Lower TCO*
Highest imaging speed and efficiency
2-3x higher imaging throughput per head enabled by fewer scans over the imaging area
2x higher throughput on conventional solder mask inks enabled by UV+IR imaging
Outstanding imaging quality for superior yields
Best line quality on challenging topographies thanks to 3x higher depth of focus (±500 µm)
Excellent surface and solder mask imaging quality thanks to 3‑wavelength spectrum
Best-in-class availability and reliability
Real-time visibility and predictive control (sensor and SW enabled)
Predictive maintenance capability reduces service and maintenance costs
Lowest TCO* over the equipment lifecycle
Reduced system complexity — from fewer heads
Lower initial CapEx, simplified service and reduced after-sales costs
* Total cost of ownership: all costs of the machine lifecycle inc. maintenance, spare parts and service
** Overall equipment effectiveness: machine performance, quality and availability
X series
Available on all X series models
From short-run to mass production
From standard PCBs dimensions to world-largest oversize boards
All models include PX imaging technology
X1000
Compact, versatile DI system for short-run, QTA to high-volume (turnkey automated), and diverse resist/solder mask applications
1-3 PX heads
Single table
24 × 32” max. exposure area
24” × endless
Automation options
X1000A — Island of automation or in-line
X1000 R2R — Flex (FPCB) reel-to-reel
Discover X1000
X2000
Flexible DI model equipped with a dual-table system and designed for continuous mid- to high-volume production
1-3 PX heads
Dual table
24 × 26” max. exposure area — X2000 Standard
24 × 48” max. exposure area — X2000 XL — 2nd table
Automation options
X2000A — Island of automation or in-line
Discover X2000
X3000
World’s largest DI system supporting oversized panels up to 48“ x 110“ or multiple panels in a single exposure run
1-3 PX heads
Single table with 4 vacuum zones
48 × 110” max. exposure area
Up to 12x (18 × 24”) panels in one imaging run
Discover X3000
Get to know us
About us
15+ years
of engineering excellence and direct imaging innovation
Since 2010
100+
100+ installations worldwide, with a proven track record across industries
North America, Europe and Asia
4
Sales, service and support centers. Partnerships in all key manufacturing regions
Get in touch
Limata GmbH
Gutenbergstr. 4, 85737 Ismaning, Germany
info@limata.de
+49 89 21 90 91 130
Let’s discuss your production needs
Tell us about your direct imaging requirements and we’ll configure a Limata system tailored to your process — down to the details
Get in touch